Antenna module and dual-band antenna apparatus

ABSTRACT

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 15/993,821 filed on May 31, 2018, which claims the benefit under 35 USC 119(a) of Korean Patent Application No. 10-2017-0179224 filed on Dec. 26, 2017, in the Korean Intellectual Property Office, the entire disclosures of which are incorporated herein by reference for all purposes.

BACKGROUND 1. Field

This application relates to an antenna module and a dual-band antenna apparatus.

2. Description of Related Art

Recently, millimeter wave (mmWave) communications systems including 5th generation (5G) communications systems have been actively researched, and research into the commercialization of an antenna module able to smoothly implement millimeter wave communications is being actively undertaken.

Conventionally, an antenna module providing a millimeter wave communications environment uses a structure in which an integrated circuit (IC) and an antenna are disposed on a board and are connected to each other by a coaxial cable to satisfy a high level of antenna performance (e.g., a transmission and reception rate, a gain, and a directivity) at a high frequency.

However, such a structure may cause a reduction of antenna layout space, a restriction of the degree of freedom of an antenna shape, an increase in interference between the antenna and the IC, and an increase in the size and cost of the antenna module.

SUMMARY

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members configured to transmit or receive a radio frequency (RF) signal; and first feed vias each having a first end electrically connected to a corresponding one of the first antenna members, and a second end electrically connected to a corresponding wire of at least one wiring layer of the connection member, wherein the connection member further includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive an RF signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

The second antenna member may be a dipole including a first pole and a second pole, the feed line may include a first feed line electrically connected to the first pole, and a second feed line electrically connected to the second pole, and the ground member may have a width greater than a distance between the first feed line and the second feed line and less than a total dipole length of the first pole and the second pole.

The second antenna member may have an intrinsic frequency band determined by characteristics of the second antenna member, and an expanded frequency band determined by the width of the ground member.

The connection member may further include a second ground member spaced apart from the feed line in a direction opposite to the direction in which the ground member is spaced apart from the feed line so that the feed line is disposed between the ground member and the second ground member.

The connection member may further include a third ground member spaced apart from the second antenna member in a direction toward the first surface or the second surface of the connection member; and a fourth ground member spaced apart from the second antenna member in a direction opposite to the direction in which the third ground member is spaced apart from the second antenna member so that the second antenna member is disposed between the third ground member and the fourth ground member, one of the third ground member and the fourth ground member may be disposed on a same level as the ground member, and a remaining one of the third ground member and the fourth ground member may be disposed on a same level as the second ground member.

The connection member may further include a third ground member spaced apart from the second antenna member in a direction toward the first surface or the second surface of the connection member; and a fourth ground member spaced apart from the second antenna member in a direction opposite to the direction in which the third ground member is spaced apart from the second antenna member so that the second antenna member is disposed between the third ground member and the fourth ground member.

The connection member may further include a fifth ground member disposed closer to the connection member than the second antenna member and connecting the third ground member and the fourth ground member to each other, and the fifth ground member may be disposed to block between a portion of the second antenna member and the ground member and to open between a remaining portion of the second antenna member and the ground member.

The second antenna member may be a dipole including a first pole and a second pole spaced apart from the first pole, the third ground member may have a first gap extending between the first pole and the second pole, and the fourth ground member may have a second gap extending between the first pole and the second pole.

The connection member may further include a pole via connecting one of the first pole and the second pole to one of the third ground member and the fourth ground member.

The connection member may further include a director member disposed between the third ground member and the fourth ground member, extending across the first gap and the second gap, and spaced apart from the second antenna member.

The connection member may further include a second feed via electrically connected between the feed line and the second antenna member, and the ground member may be spaced apart from a side surface of the feed via.

The connection member may further include an impedance conversion line electrically connected between the feed line and the second antenna member, and the ground member may be spaced apart from the impedance conversion line in the direction toward the first surface or the second surface of the connection member.

The connection member may further include a ground layer disposed on a same level as the feed line in the connection member and spaced apart from the feed line; and shielding vias extending from the ground layer to block between at least one wiring layer of the connection member and the second antenna member.

The antenna package may further include a dielectric layer surrounding a side surface of each of the plurality of first feed vias and having a height greater than a height of at least one insulating layer of the connection member; and a plating member disposed in the dielectric layer surrounding the side surface of each of the plurality of first feed vias.

In another general aspect, a dual-band antenna apparatus includes a first feed line having a first end electrically connected to an integrated circuit (IC); a second feed line having a first end electrically connected to the IC; a first pole electrically connected to a second end of the first feed line and configured to transmit or receive a radio frequency (RF) signal; a second pole electrically connected to a second end of the second feed line and configured to transmit or receive the RF signal; a first ground member spaced apart from the first feed line and the second feed line in a first direction; and a second ground member spaced apart from the first feed line and the second feed line in a second direction opposite to the first direction, wherein each of the first ground member and the second ground member has a width greater than a distance between the first feed line and the second feed line, and less than a total dipole length of the first pole and the second pole, and the first pole and the second pole have an intrinsic frequency band of a dipole, and an expanded frequency band different from the intrinsic frequency band determined by the width of the first ground member and the width of the second ground member.

The dual-band antenna apparatus may further include a first arm member covering a first side of the first pole; a second arm member covering a second side of the first pole opposite to the first side of the first pole; a third arm member covering a first side of the second pole; a fourth arm member covering a second side of the second pole opposite to the first side of the second pole; a first pole via connecting the first arm member and the first pole to each other; and a second pole via connecting the third arm member and the second pole to each other.

In another general aspect, an antenna module includes a connection member including wiring layers; a feed line connected to a wire in a wiring layer of the connection member; a first antenna member connected to the feed line and configured to either one or both of transmit a first radio frequency (RF) signal and receive a second RF signal; and a first ground member connected to a wiring layer of the connection member, the first ground member being spaced apart from the feed line, and disposed between the wiring layer to which the first ground member is connected and the first antenna member.

The antenna module may further include a second ground member spaced apart from the first antenna member and the first ground member.

The first ground member may be an extension of the wiring layer to which the first ground member is connected, and may extend in a first direction toward the antenna member; and the first antenna member may be further configured to either one or both of transmit the first RF signal in the first direction and receive the second RF signal in a direction opposite to the first direction.

The antenna module may further include an antenna package disposed on a surface of the connection member, the antenna package including a second antenna member configured to either one or both of transmit a third RF signal in a second direction different from the first direction and receive a fourth RF signal in a direction opposite to the second direction; and a connecting member connecting the second antenna member to a wire in a wiring layer of the connection member, wherein the third RF signal may be the same as or different from the first RF signal, and the fourth RF signal may be the same as or different from the second RF signal.

In another general aspect, an antenna module includes first antenna members disposed in a central portion of the antenna module, the first antenna members facing in a first direction; first antenna apparatuses disposed along a first section of a periphery of the antenna module, each of the first antenna apparatuses including a first feed line extending toward the first section of the periphery of the antenna module; a second antenna member connected to the first feed line and extending substantially parallel to the first section of the periphery of the antenna module, the second antenna member facing in a second direction different from the first direction; and a first ground member spaced apart from the first feed line and extending toward the first section of the periphery of the antenna module;

The antenna module may further include second antenna apparatuses disposed along a second section of the periphery of the antenna module, the second section of the periphery of the antenna module adjoining the first section of the periphery of the antenna module and forming an angle of less than 180° with the first section of the periphery of the antenna module, each of the second antenna apparatuses including a second feed line extending toward the second section of the periphery of the antenna module; a third antenna member connected to the second feed line and extending substantially parallel to the second section of the periphery of the antenna module, the third antenna member facing in a third direction different from the first direction and the second direction; and a second ground member spaced apart from the second feed line and extending toward the second section of the periphery of the antenna module.

The antenna module may further include first chip antennas and first dipole antennas disposed between the first antenna members and the first section of the periphery of the antenna module, the first chip antennas and the first dipole antennas facing in the second direction; and second chip antennas and second dipole antennas disposed between the first antenna members and the second section of the periphery of the antenna module, the second chip antennas and the second dipole antennas facing in the third direction.

In another general aspect, an electronic device includes a case; the antenna module described above disposed in the case so that the first section of the periphery of the antenna module is adjacent to a first side boundary of the case, and the second section of the periphery of the antenna module is adjacent to a second side boundary of the case; and an integrated circuit (IC) configured to receive a baseband signal and generate a radio frequency (RF) signal from the baseband signal, wherein each of the first antenna members is connected to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in the first direction, each of the second antenna members is connected to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in the second direction, and each of the third antenna members is connected to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in the third direction.

Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a view illustrating an example of an antenna module.

FIG. 2 is a view illustrating an example of an antenna module including a second ground member.

FIG. 3 is a view illustrating an example of an antenna module including third and fourth ground members.

FIG. 4 is a view illustrating an example of an antenna including a fifth ground member, and a width of a ground member.

FIG. 5 is a view illustrating an example of an antenna module including a feed via.

FIG. 6 is a view illustrating an example of an antenna module including a plurality of dipoles.

FIG. 7 is a view illustrating an example of an antenna module including a ground layer and a plurality of shielding vias.

FIG. 8 is a view illustrating an example of an antenna module including a ground layer having a different form.

FIG. 9 is a view illustrating an example of an antenna module including a director member.

FIG. 10 is a view illustrating an example of an antenna module including a folded dipole and a director member having a different form.

FIGS. 11A and 11B are views illustrating an example of a dual-band antenna apparatus.

FIG. 12 is a view illustrating an example of an antenna module including an integrated circuit (IC) and an antenna package.

FIG. 13 is a view illustrating an example of an antenna module including an IC package.

FIG. 14 is a view illustrating an example of layout positions of an antenna module and a dual-band antenna apparatus.

FIGS. 15A and 15B are graphs respectively illustrating S-parameters and gains as a function of frequency of an antenna module and a dual-band antenna apparatus.

FIGS. 16A and 16B are views illustrating examples of layouts of an antenna module in an electronic device.

Throughout the drawings and the detailed description, the same reference numerals refer to the same elements. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order. Also, descriptions of features that are known in the art may be omitted for increased clarity and conciseness.

The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.

Throughout the specification, when an element, such as a layer, region, or substrate, is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween.

Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.

Spatially relative terms such as “above,” “upper,” “below,” and “lower” may be used herein for ease of description to describe one element's relationship to another element as shown in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being “above” or “upper” relative to another element will then be “below” or “lower” relative to the other element. Thus, the term “above” encompasses both the above and below orientations depending on the spatial orientation of the device. The device may also be oriented in other ways (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein are to be interpreted accordingly.

The terminology used herein is for describing various examples only, and is not to be used to limit the disclosure. The articles “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “includes,” and “has” specify the presence of stated features, numbers, operations, members, elements, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, members, elements, and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, variations of the shapes shown in the drawings may occur. Thus, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shape that occur during manufacturing.

The features of the examples described herein may be combined in various ways as will be apparent after an understanding of the disclosure of this application. Further, although the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the disclosure of this application.

FIG. 1 is a view illustrating an example of an antenna module.

Referring to FIG. 1, an antenna module includes a connection member 200 a. The connection member 200 a includes at least one wiring layer and at least one insulating layer, and has a first surface (e.g., a lower surface) on which an integrated circuit (IC) (not illustrated in FIG. 1) is disposed, and a second surface (e.g., an upper surface) on which an antenna package (not illustrated in FIG. 1) is disposed.

The antenna package is implemented to be homogeneous or heterogeneous with respect to the connection member 200 a, and transmits or receives a radio frequency (RF) signal in a first direction in which the second surface (e.g., the upper surface) of the connection member 200 a on which the antenna package is disposed faces. In the example illustrated in FIG. 1, the antenna package transmits or receives the RF signal in a vertical direction perpendicular to the second surface (e.g., the upper surface) of the connection member 200. Therefore, the antenna module forms a radiation pattern in the first direction so that the RF signal is transmitted or received in the first direction.

Referring to FIG. 1, the antenna module includes a feed line 110 a, an antenna member 120 a, and a ground member 130 a that enable the antenna module to form a radiation pattern in a second direction in which a side surface of the connection member 200 a faces to transmit or receive an RF signal in the second direction. In the example illustrated in FIG. 1, the antenna module transmits or receives the RF signal in a horizontal direction perpendicular to the left side surface of the connection member 200. That is, the antenna module omnidirectionally expands the transmission and reception direction of an RF signal.

The feed line 110 a is electrically connected to at least one wiring layer of the connection member 200 a. That is, the feed line 110 a transmits the RF signal to the IC through at least one wiring layer of the connection member 200 a, and receives the RF signal from the IC through at least one wiring layer of the connection member 200 a, which may be the same as or different from the at least wiring layer through which the feed line transmits the RF signal.

The antenna member 120 a is electrically connected to the feed line 110 a and is configured to transmit or receive the RF signal. In the example illustrated in FIG. 1, the antenna member 120 a is a dipole including a first pole and a second pole. The first pole and the second pole are respectively electrically connected to a first feed line and a second feed line of the feed line 110 a.

The antenna member 120 a has an intrinsic frequency band (e.g., 28 GHz) determined by characteristics of the antenna member 120 (e.g., a pole length, a pole thickness, a distance between poles, a distance between a pole and a side surface of the connection member 200 a, and a dielectric permittivity of an insulating layer).

The ground member 130 a is spaced apart from the feed line 110 a in a direction toward the first surface (e.g., a downward direction) or the second surface (e.g., an upward direction) of the connection member 200 a.

The ground member 130 a is electromagnetically coupled to the antenna member 120 a and influences frequency characteristics of the antenna member 120 a depending on characteristics of the ground member 130 a (e.g., a width, a length, a thickness, a distance between the ground member 130 a and the feed line 110 a, and a degree of electrical isolation between the ground member 130 a and the antenna member 120 a).

In one example, the ground member 130 a causes the antenna member 120 a to have an expanded frequency band (e.g., 38 GHz). In another example in which the expanded frequency band of the antenna member 120 a is similar to the intrinsic frequency band of the antenna member 120 a, the ground member 130 a improves a bandwidth or a gain of the intrinsic frequency band of the antenna member 120 a.

Therefore, the antenna module of FIG. 1 improves an antenna performance (e.g., a transmission and reception rate, a gain, a bandwidth, and a directivity) in a second direction in which the antenna member 120 a transmits or receives an RF signal, and enables dual-band transmission and reception in the second direction.

The antenna module of FIG. 1 further includes an impedance conversion line 115 a, a third ground member 140 a, and a fifth ground member 145 a.

The impedance conversion line 115 a is electrically connected between the feed line 110 a and the antenna member 120 a. For example, the impedance conversion line 115 a has a thickness different from a thickness of the feed line 110 a so that the impedance conversion line 115 a has an impedance different from an impedance of the feed line 110 a. In the example illustrated in FIG. 1, the impedance conversion line 115 a is directly connected to the antenna member 120 a, but depending on a design of the antenna module, the impedance conversion line 115 a may be connected to one end of the feed line 110 a, or may be disposed adjacent to the center of the connection member 200 a.

The third ground member 140 a is spaced apart from the antenna member 120 a in a direction toward the first surface (e.g., the lower surface) of the connection member 200 a. The third ground member 140 a is electromagnetically coupled to the antenna member 120 a to improve a gain or a transmission and reception rate of the antenna member 120 a.

In the example illustrated in FIG. 1, the third ground member 140 a includes a plurality of ground patterns separated by a gap corresponding to a form (e.g., a dipole in the example illustrated in FIG. 1) of the antenna member 120 a, and has a width equal to or greater than a width of the antenna member 120 a to fully oppose an entire lower surface of the antenna member 120 a.

The fifth ground member 145 a extends in an upward direction from an end portion of the third ground member 140 a along an edge of the third ground member 145 a closest to the connection member 200 a. In the example illustrated in FIG. 1, the fifth ground member 145 a is disposed to block between a portion (e.g., an end portion of the dipole) of the antenna member 120 a and the ground member 130 a, and to open between the remaining portion (e.g., a start portion of the dipole) of the antenna member 120 a and the ground member 130 a. Accordingly, an electromagnetic coupling of the ground member 130 a to the antenna member 120 a may be precisely adjusted, and an isolation between the antenna member 120 a and the at least one wring layer of the connection member 200 a may be improved.

FIG. 2 is a view illustrating an example of an antenna module including a second ground member.

Referring to FIG. 2, an antenna module further includes a second ground member 135 a spaced apart from the feed line 110 a in a direction toward the second surface (e.g., the upper surface) of the connection member 200 a so that the feed line 110 a and/or the impedance conversion line 115 a are disposed between the ground member 130 a and the second ground member 135 a.

The second ground member 135 a is electromagnetically coupled to the antenna member 120 a and influences frequency characteristics of the antenna member 120 a depending on the characteristics of the second ground member 135 a (e.g., a width, a length, a thickness, a distance between the second ground member 135 a and the feed line 110 a, and a degree of electrical isolation between the second ground member 135 a and the antenna member 120 a).

The second ground member 135 a may have the same form as the ground member 130 a, or may have a form different from the form of the ground member 130 a, or may be omitted according to design factors (e.g., a detailed wiring layout of the connection member 200 a, whether or not an IC package is mounted on the connection member 200 a, characteristics of the antenna member 120 a, frequency characteristics of an RF signal transmitted or received by the antenna member 120 a, a process of manufacturing an antenna module, an entire size of the antenna module, and a manufacturing cost of the antenna module).

Either one or both of the third ground member 140 a and the fifth ground member 145 a illustrated in FIG. 1 may also be omitted according to the design factors referred to above.

FIG. 3 is a view illustrating an example of an antenna module including third and fourth ground members.

Referring to FIG. 3, an antenna module further includes a fourth ground member 155 a spaced apart from the antenna member 120 a in a direction toward the second surface (e.g., the upper surface) of the connection member 200 a. The third ground member 140 a may be disposed on a same level as the ground member 130 a, and the fourth ground member 155 a may be disposed on a same level as the second ground member 135 a. The fifth ground member 145 a connects the third ground member 140 a and the fourth ground member 155 a to each other. The fourth ground member 155 a is electromagnetically coupled to the antenna member to improve a gain or a transmission and reception rate of the antenna member.

In addition, since the antenna member 120 a is disposed between the third ground member 140 a and the fourth ground member 155 a, a directivity of a radiation pattern of the antenna member 120 a is improved.

FIG. 4 is a view illustrating an example of an antenna module including a fifth ground member, and a width of a ground member.

Referring to FIG. 4, a fifth ground member 145 b of an antenna module is implemented as a structure in which a plurality of vias are disposed along a straight line and are parallel to each other. However, this is only one example, and the plurality of vias may be arranged in other ways.

In the example illustrated in FIG. 4, a width of the ground member 130 a is matched to a position a first via of the fifth ground member 145 b, that is, a via of the fifth ground member 145 b closest to the feed line 110 a.

In one example, the ground member 130 a has a small width (e.g., L) to increase an expanded frequency band of the antenna member 120 a. In another example, the ground member has a large width (e.g., L+M/2+M/2) to decrease the expanded frequency band of the antenna member 120 a.

FIG. 5 is a view illustrating an example of an antenna module including a feed via.

Referring to FIG. 5, an antenna module further includes a feed via 110 b electrically connected between the feed line 110 a and an antenna member 120 b. The ground member 130 a is spaced apart from the feed via 110 b in a direction toward a side surface of the connection member 200 a.

The feed via 110 b enables the antenna member 120 b to be disposed at a lower position relative to the ground member 130 a than the antenna member 120 a illustrated in FIGS. 1 through 4, and also to be disposed below a first surface (e.g., a lower surface) of the connection member 200 a depending on a design of the antenna module. Accordingly, the antenna member 120 b forms a radiation pattern at a lower position than the antenna member 120 a illustrated in FIGS. 1 through 4, thereby enabling the transmission and reception direction of the RF signal of the antenna module to be more efficiently expanded.

The antenna module of FIG. 5 further includes a ground via 131 a extending downward from a lower surface of the ground member 130 a to an upper surface of a third ground member 140 b to connect the ground member 130 a to the third ground member 140 b.

FIG. 6 is a view illustrating an example of an antenna module including a plurality of dipoles.

Referring to FIG. 6, an antenna module includes a plurality of antenna members 120 a and 120 b disposed parallel to each other. The plurality of antenna members 120 a and 120 b are electrically connected to each other by the feed via 110 b.

In addition, the antenna module further includes a plurality of third antenna members 140 a and 140 b respectively spaced apart from the plurality of antenna members 120 a and 120 b in a downward direction.

Accordingly, since a space occupied by each of the plurality of antenna members 120 a and 120 b may be efficiently distributed in the connection member 200 a, the antenna module further improves an antenna performance and prevents an excessive size expansion of the antenna module.

FIG. 7 is a view illustrating an example of an antenna including a ground layer and a plurality of shielding vias.

Referring to FIG. 7, the antenna module includes a ground layer 225 a disposed at a same level as the feed line 110 a in the connection member and spaced apart from the feed line 110 a.

The ground layer 225 a acts as a reflector with respect to the antenna member 120 a. That is, the ground layer 225 a improves an antenna performance of the antenna member 120 a.

In addition, the antenna module further includes a plurality of shielding vias 245 a extending upward from the ground layer 225 a to block between a wiring layer 210 a and the antenna member 120 a.

The plurality of shielding vias 245 a reduce a transmission loss of the RF signal of the wiring layer 210 a, act as reflectors with respect to the antenna member 120 a, and improve an isolation between the antenna member 120 a and the wiring layer 210 a.

FIG. 8 is a view illustrating an example of an antenna module including a ground layer having a different form.

Referring to FIG. 8, a portion of a boundary of a ground layer 225 b closest to the antenna member 120 a and crossing the ground member 130 a is closer to the center of the connection member than in the example illustrated in FIG. 7, thereby increasing a length of the ground member 130 a. Accordingly, since the length of the ground member 130 a is extended, the antenna member 120 a and the third ground member 140 a may be disposed closer to the center of the connection member than in the example illustrated in FIG. 7, thereby enabling an area of the connection member to be reduced. Accordingly, a size of the antenna module may also be reduced.

In the example illustrated in FIG. 8, the ground layer 225 b has a form obtained by removing a partial region of the ground layer 225 a illustrated in FIG. 7. A width of the partial region corresponds to the width of the ground member 130 a, and a length of the partial region may be varied according to any one or any combination of any two or more of a layout position of the antenna member 120 a, a frequency band, and a detailed wiring layout of the connection member.

FIG. 9 is a view illustrating an example of an antenna module including a director member.

Referring to FIG. 9, the antenna module further includes a director member 125 a spaced apart from the third ground member 140 c in a direction toward the second surface (e.g., the upper surface) of the connection member 200 a, extending across a gap in the third ground member 140 c, and spaced apart from the antenna member 120 a in a direction away from the connection member 200 a. In one example, the director member 125 a is disposed on a same level as the antenna member 120 a, but is not limited thereto.

The director member 125 a is electromagnetically coupled to the antenna member 120 a to improve a gain or a bandwidth of the antenna member 120 a. The director member 125 a has a length less than a total dipole length of the antenna member 120 a, and the electromagnetic coupling between the antenna member 120 a and the director member 125 a increases as the length of the director member 125 a decreases. Accordingly, a directivity of the antenna member 120 a is further improved.

FIG. 10 is a view illustrating an example of an antenna including a folded dipole and a director member having a different form.

Referring to FIG. 10, an antenna member 120 c included in the antenna module is a folded dipole, and a director member 125 b included in the antenna module is curved.

If necessary, a size of the third ground member 140 c is greater than a size of the third ground member 140 c illustrated in FIG. 9 to accommodate the expanded form of the antenna member 120 c and the expanded form of the director member 125 b.

FIGS. 11A and 11B are views illustrating an example of a dual-band antenna apparatus.

Referring to FIG. 11A, a dual-band antenna apparatus includes a feed line 110 d, an impedance conversion line 115 d, a pole 120 d, arm members 130 d and 135 d, and a ground member (not illustrated in FIG. 11A, but see FIGS. 1 through 10 for examples).

The feed line 110 d is electrically connected to an IC (not illustrated in FIG. 11A). The feed line 110 d includes first and second feed lines having a bilaterally symmetric structure.

The pole 120 d is electrically connected to the feed line 110 d and configured to transmit or receive an RF signal. The pole 120 d has an intrinsic frequency band determined by characteristics of the pole 120 d. In the example illustrated in FIG. 11A, the pole 120 d is implemented as first and second poles having a bilaterally symmetric structure.

The ground member is spaced apart from the feed line 110 d in a direction toward an upper surface or a lower surface of a connection member (not illustrated in FIG. 11A but see FIGS. 1 through 10 for examples), and has a width greater than a distance between the first and second feed lines of the feed line 110 d, and is less than a total dipole length of the first and second poles of the pole 120 d.

The ground member is electromagnetically coupled to the pole 120 d, and the width of the ground member influences frequency characteristics of the pole 120 d to provide the pole 120 d with an expanded frequency band.

Therefore, the dual-band antenna apparatus is able to transmit and receive a dual-band RF signal within the expanded frequency band while having a simplified structure.

The arm members 130 d and 135 d oppose opposite sides of the pole 120 d so as to be electromagnetically coupled to the pole 120 d. In the example illustrated in FIG. 11A, the arm member 130 d covers one side of the pole 120 d, and the arm member 135 d covers the opposite side of the pole 120.

Referring to FIG. 11B, the dual-band antenna apparatus further includes a pole via 150 a connecting the arm member 135 d and the pole 120 d to each other.

The pole via 150 a adjusts a direction of current flowing in the pole 120 d. For example, the pole via 150 a adjusts an electrical distance of one of the first and second poles of the pole 120 d so that a current direction or a phase of each of the first and second poles of the pole 120 d is the same.

The pole via 150 a may be included in the antenna modules illustrated in FIGS. 1 through 10 to connect the antenna member and the third or fourth ground member to each other, and perform the same function performed by the pole via 150 a in the dual-band antenna apparatus of FIGS. 11A and 11B.

FIG. 12 is a view illustrating an example of an antenna including an integrated circuit (IC) and an antenna package.

Referring to FIG. 12, the antenna module has a heterogeneous structure in which an antenna package and a connection member are connected to each other. That is, the antenna module may be miniaturized while improving an antenna performance (e.g., a transmission and reception rate, a gain, and a directivity) by utilizing both characteristics that make it possible to improve the antenna performance of the antenna package and characteristics that make it possible to dispose a circuit pattern or an integrated circuit (IC) of the connection member.

The connection member includes at least one wiring layer 1210 b and at least one insulating layer 1220 b. The connection member includes a wiring via 1230 b connected to at least one wiring layer 1210 b and a connection pad 1240 b connected to the wiring via 1230 b. The connection pad 1240 b may have a structure similar to a copper redistribution layer (RDL).

In the example illustrated in FIG. 12, the antenna package is disposed on an upper surface of the connection member.

The antenna package includes a plurality of director members 1110 b, a plurality of antenna members 1115 b, a plurality of feed vias 1120 b, a dielectric layer 1140 b, an encapsulation member 1150 b, and a plating member 1160 b.

The plurality of director members 1110 b are disposed adjacent to one surface of the antenna module (an upper surface of the antenna module in the example illustrated in FIG. 12), and receive an RF signal or transmit the RF signal generated by an IC 1301 b together with corresponding ones of the plurality of antenna members 1115 b disposed below the plurality of director members 1110 b.

Depending on a design of the antenna package, the plurality of director members 1110 b may be omitted, or at least one additional director member may be further disposed above each of the plurality of director members 1110 b.

The plurality of antenna members 1115 b are electromagnetically coupled to the plurality of director members 1110 b disposed above the plurality of antenna members 1115 b, and receive the RF signal or transmit the RF signal generated by the IC 1301 b together with corresponding ones of the plurality of director members 1110 b. In one example, the plurality of antenna members 1115 b have a shape (e.g., a patch antenna) similar to a shape of corresponding ones of the plurality of director members 1110 b.

The plurality of feed vias 1120 b are electrically connected to the plurality of antenna members 1115 b to provide a path for the RF signal. The plurality of feed vias 1120 b have a length greater than a thickness of at least one insulating layer 1220 b of the connection member. Accordingly, a transmission efficiency of the RF signal is improved.

The dielectric layer 1140 b surrounds a side surface of each of the plurality of feed vias 1120 b. The dielectric layer 1140 b has a height greater than a height of at least one insulating layer 1220 b of the connection member. The antenna performance of the antenna package improves as a height and/or a width of the dielectric layer 1140 b increases, and the antenna package provides boundary conditions (e.g., a small manufacturing tolerance, a short electrical length, a smooth surface, a large size of the dielectric layer, and an adjustment of a dielectric constant) that are advantageous in a transmission and reception operation of an RF signal of the plurality of antenna members 1115 b.

In one example, the dielectric layer 1140b and at least one insulating layer 1220 b are made of a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide resin, a resin in which the thermosetting resin or the thermoplastic resin is impregnated together with an inorganic filler in a core material such as a glass fiber (or a glass cloth or a glass fabric), for example, a prepreg, Ajinomoto Build-up Film (ABF), FR-4, bismaleimide triazine (BT), a photo-imageable dielectric (PID) resin, a generic copper clad laminate (CCL), a glass-based insulating material, or a ceramic-based insulating material.

The dielectric layer 1140 a has a dielectric constant greater than a dielectric constant Dk of at least one insulating layer 1220 b of the connection member. In one example, the dielectric layer 1140 a is made of glass, ceramic, or silicon having a large dielectric constant (e.g., 5 or more), and at least one insulating layer 1220 b of the connection member is made of copper clad laminate (CCL) or a prepreg having a relatively small dielectric constant.

The encapsulation member 1150 b is disposed on the dielectric layer 1140 b, and improves a durability of the plurality of antenna members 1115 b and the plurality of director members 1110 b against impact or oxidation. In one example, the encapsulation member 1150 b is made of a photo-imageable encapsulant (PIE), Ajinomoto Build-Up Film (ABF), or an epoxy molding compound (EMC), but is not limited thereto.

The plating member 1160 b is disposed in the dielectric layer 1140 b surrounding a side surface of each of the plurality of feed vias 1120 b. That is, the plating member 1160 b forms a plurality of cavities respectively corresponding to the plurality of antenna members 1115 b to provide a boundary condition for transmission and reception of the RF signal by the plurality of antenna members 1115.

The IC 1301 b, a power management integrated circuit (PMIC) 1302 b, and a plurality of passive components 1351 b, 1352 b, and 1353 b are disposed on a lower surface of the connection member. However, this is merely one example, and the components disposed on the lower surface of the connection member are not limited to these components.

The IC 1301 b generates an RF signal transmitted to the plurality of antenna members 1115 b and receives an RF signal from the plurality of antenna members 1115 b.

The PMIC 1302 b generates power and transmits the generated power to the IC 1301 b through at least one wiring layer 1210 b of the connection member.

The plurality of passive components 1351 b, 1352 b, and 1353 b provide an impedance to either one or both of the IC 1301 b and the PMIC 1302 b. For example, the plurality of passive components 1351 b, 1352 b, and 1353 b may include any one or any combination of a capacitor (e.g., a multilayer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

In the example illustrated in FIG. 12, the IC 1301 b, the power management integrated circuit (PMIC) 1302 b, and the plurality of passive components 1351 b, 1352 b, and 1353 b are connected to the connection member through an electrical connection structure 1260 b and a passivation layer 1250 b, but the electrical connection structure 1260 b and the passivation layer 1250 b may be omitted depending on a design of the IC 1301 b, the power management integrated circuit (PMIC) 1302 b, and the plurality of passive components 1351 b, 1352 b, and 1353 b.

The connection member includes an antenna apparatus 100 e including a feed line 110 e, a second antenna member (not illustrated in FIG. 12) connected to the feed line 110 e, a ground member 130 e, and a second ground member 135 e. The feed line 110 e, the second antenna member, the ground member 130 e, and the second ground member 135 e are similar to the feed line, the antenna member, the ground member, and the second ground member, respectively, described above with reference to FIGS. 1 through 11B, and the antenna apparatus 100 e may further include the impedance conversion line, the third, fourth, and fifth ground members, the ground layer, and the shielding vias described above with reference to FIGS. 1 through 11B.

Depending on a design of the antenna package, the antenna package may be implemented to be homogeneous with the connection member. For example, the antenna package may include a plurality of antenna members each implemented by a metal pattern in a layer of the connection member, and a plurality of feed vias each implemented by a plurality of vias of the connection member connected together in the vertical direction. Whether or not the antenna package is implemented to be homogeneous with the connection member may be determined depending on characteristics of the dielectric layer 1140 b.

FIG. 13 is a view illustrating an example of an antenna module including an IC package.

Referring to FIG. 13, an IC package includes an IC 1300 a, an encapsulant 1305 a encapsulating at least a portion of the IC 1300 a, a core member 1355 a disposed so that a first side surface thereof faces the IC 1300 a, and a connection member including at least one wiring layer 1310 a and an insulating layer 280 a. The connection member of the IC package is electrically connected to the IC 1300 a and the core member 1355 a, and is connected to another connection member as illustrated in FIG. 13, or an antenna package.

The connection member to which the IC package is connected includes at least one wiring layer 1210 a, at least one insulating layer 1220 a, a wiring via 1230 a, a connection pad 1240 a, and a passivation layer 1250 a. The antenna package includes a plurality of director members 1110 a, 1110 b, 1110 c, and 1110 d, a plurality of antenna members 1115 a, 1115 b, 1115 c, and 1115 d, a plurality of feed vias 1120 a, 1120 b, 1120 c, and 1120 d, a plurality of cavities 1130 a, 1130 b, 1130 c, and 1130 d, a dielectric layer 1140 a, an encapsulation member 1150 a, and a plating member 1170 a.

The IC package is connected to the connection member described above. A first RF signal generated by the IC 1300 a included in the IC package is transmitted to the antenna package through at least one wiring layer 1310 a to be transmitted in an upward direction from the antenna package, and a first RF signal received in a downward direction by the antenna package is transmitted to the IC 1300 a through at least one wiring layer 1310 a.

The IC package further includes connection pads 1330 a disposed on an upper surface and/or a lower surface of the IC 1300 a. The connection pads 1330 a disposed on the upper surface of the IC 1300 a are electrically connected to at least one wiring layer 1310 a, and the connection pads 1330 a disposed on the lower surface of the IC 1300 a are electrically connected to the core member 1355 a or a core plating member 1365 a through a wiring layer 1320 a. The core plating member 1365 a provides a ground region for the IC 1300 a.

The core member 1355 a includes a core dielectric layer 356 a in contact with the connection member of the IC package, core wiring layers 1359 a disposed on an upper surface and/or a lower surface of the core dielectric layer 356 a, and at least one core via 1360 a penetrating through the core dielectric layer 356 a, and electrically connected to the core wiring layers 1359 a and the connection pads 1330 a. At least one core via 1360 a is electrically connected to an electrical connection structure 1340 a such as a solder ball, a pin, or a land.

Accordingly, the core member 1355 a receives a baseband signal and/or power from a lower surface thereof, and may transmits the baseband signal and/or power to the IC 1300 a through at least one wiring layer 1310 a of the connection member.

The IC 1300 a generates an RF signal in a millimeter wave (mmWave) band using the baseband signal and/or power. For example, the IC 1300 a receives a baseband signal having a low frequency and performs frequency conversion, amplification, filtering phase control, and power generation of the baseband signal, and may be made of a compound semiconductor (e.g., GaAs) or an elemental semiconductor (e.g., silicon) in consideration of high frequency characteristics.

The IC package further includes a passive component 1350 a electrically connected to a corresponding wire of at least one wiring layer 1310 a. The passive component 1350 a is disposed in an accommodation space 1306 a provided by the core member 1355 a and provides an impedance to the IC 1300 a and/or at least one second antenna member (not illustrated in FIG. 13). In one example, the passive component 1350 a includes a multilayer ceramic capacitor (MLCC), an inductor, or a chip resistor.

The IC package includes core plating members 1365 a and 370 a disposed on side surfaces of the core member 1355 a. The core plating members 1365 a and 370 a provide a ground region for the IC 1300 a, and radiate heat produced by the IC 1300 a to the outside or remove noise generated by the IC 1300 a.

The IC package and the antenna package may be manufactured independently of each other and then connected together, or may be manufactured as a single unit depending on a design of the IC package and the antenna package. That is, a separate process of connecting together the IC package and the antenna package may be omitted.

In the example illustrated in FIG. 13, the IC package is connected to the connection member through an electrical connection structure 1290 a and a passivation layer 285 a, but the electrical connection structure 1290 a and the passivation layer 285 a may be omitted depending on a design of the IC package.

The connection member includes an antenna apparatus 100 f including a feed line 110 f, a second antenna member (not illustrated in FIG. 13) connected to the feed line 110 f, a ground member 130 f, and a second ground member 135 f. The feed line 110 f, the second antenna member, the ground member 130 f, and the second ground member 135 f are similar to the feed line, the antenna member, the ground member, and the second ground member, respectively, described above with reference to FIGS. 1 through 11B, and the antenna apparatus 100 f may further include the impedance conversion line, the third, fourth, and fifth ground members, the ground layer, and the shielding vias described above with reference to FIGS. 1 through 11B.

FIG. 14 is a view illustrating an example of layout positions of an antenna module and a dual-band antenna apparatus.

Referring to FIG. 14, an antenna module includes a plurality of director members 1110 d, a cavity 1130 d, a dielectric layer 1140 d, a plating member 1160 d, a plurality of chip antennas 1170 c and 1170 d, and a plurality of dipole antennas 1175 c and 1175 d.

The plurality of director members 1110 d transmit and receive an RF signal in a z axis direction together with corresponding antenna members (not illustrated in FIG. 14 but similar to the antenna members 1115 b in FIG. 12 and the antenna members 1115 a, 1115 b, 1115 c, and 1115 d in FIG. 13) disposed beneath the plurality of director members 1110 d. The number, layout, and form of the plurality of director members 1110 d and the plurality of antenna members disposed beneath the plurality of director members 1110 d are not limited to any particular configuration. For example, the plurality of director members 1110 d may have a circular shape, rather than a square shape as illustrated in FIG. 14, and the number of plurality of director members 1110 d may be two, three, or five or more, rather than four as illustrated in FIG. 14.

The plurality of chip antennas 1170 c and 1170 d are disposed adjacent to an edge of the antenna package and extend in a z axis direction. Some of the plurality of chip antennas 1170 c and 1175 d transmit and receive the RF signal in an x axis direction, and remaining ones of the plurality of chip antennas 1170 c and 1175 d transmit and receive the RF signal in a y axis direction. Since the plurality of chip antennas 1170 c and 1175 d are disposed in the antenna package, the antenna module significantly reduces a problem of a size increase due to an increase in the number of plurality of chip antennas 1170 c and 1170 d.

The plurality of dipole antennas 1175 c and 1175 d are disposed between the dielectric layer 1140 d and an encapsulation member (not illustrated in FIG. 14) to be disposed adjacent to the edge of the antenna package. Some of the plurality of dipole antennas 1175 c and 1175 d transmit and receive an RF signal in the x axis direction, and remaining ones of the plurality of dipole antennas 1175 c and 1175 d transmit and receive the RF signal in the y axis direction. Depending on a design, at least some of the plurality of dipole antennas 1175 c and 1175 d may be replaced with a monopole antenna.

In addition, the antenna module includes a plurality of antenna apparatuses 100 c and 100 d each including a feed line, a second antenna member, and a ground member. Some of the plurality of antenna apparatuses 100 c and 100 d transmit and receive an RF signal in the x axis direction, and remaining ones of the plurality of antenna apparatuses 100 c and 100 d transmit and receive the RF signal in the y axis direction.

The plurality of antenna apparatuses 100 c and 100 d may be arranged to be parallel to a side direction of the antenna module and may be encapsulated by a dielectric layer 1140 c.

FIGS. 15A and 15B are graphs respectively illustrating S-parameters and gains as a function of frequency of an antenna module and a dual-band antenna apparatus.

Referring to FIGS. 15A and 15B, among first cases 510 a and 510 b having the shortest width of the ground member, second cases 520 a and 520 b having the second shortest width of the ground member, third cases 530 a and 530 b having the second longest width of the ground member, and fourth cases 540 a and 540 b having the longest width of the ground member, an expanded frequency band (about 41 GHz) of the first cases 510 a and 510 b is the highest and an expanded frequency band (about 36 GHz) of the fourth cases 540 a and 540 b is the lowest. Thus, the expanded frequency band decreases as the width of the ground member increases.

FIGS. 16A and 16B are views illustrating examples of layouts of an antenna module in an electronic device.

Referring to FIG. 16A, an antenna module including an antenna apparatus 100 g, a director member 1110 g, a dielectric layer 1140 g, and an integrated circuit (IC) (not illustrated in FIG. 16A, but see FIGS. 12 and 13 for examples) is disposed adjacent to a side boundary of an electronic device 400 g on a substrate 300 g of the electronic device 400 g.

The electronic device 400 g may be a smartphone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smartwatch, or an automotive component, but is not limited thereto.

A communications module 310 g and a baseband circuit 320 g are further disposed on the substrate 300 g. The communications module 310 g includes a memory chip such as a volatile memory (for example, a DRAM), a non-volatile memory (for example, a ROM), or a flash memory; an application processor chip such as a central processor (for example, a CPU), a graphics processor (for example, a GPU), a digital signal processor, a cryptographic processor, a microprocessor, or a microcontroller; and a logic chip such as an analog-digital converter or an application-specific IC (ASIC). However, these are just examples, and the communications module 310 g is not limited thereto.

The baseband circuit 320 g generates a baseband signal by performing analog-digital conversion, amplification, filtering, and frequency conversion of an analog signal. The baseband signal input and output from the baseband circuit 320 g is transmitted to the antenna module through a cable.

For example, the baseband signal may be transmitted to the IC of the antenna module through the electrical connection structure 1340 a, the core via 1360 a, and the at least one wiring layer 1310 a illustrated in FIG. 13. The IC converts the baseband signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 16B, two antenna modules each including an antenna apparatus 100 h, a director member 1110 h, a dielectric layer 1140 h and an integrated circuit (IC) (not illustrated in FIG. 16B, but see FIGS. 12 and 13 for examples) are disposed on a substrate 300 h of an electronic device 400 h so that one of the antenna modules is disposed adjacent to one side boundary of the electronic device 400 h at one end of the electronic device 400 h, and the other one of the antenna modules is disposed adjacent to an opposite side boundary of the electronic device 400 h at the opposite end of the electronic device 400 h. A communications module 310 h and a baseband circuit 320 h are further disposed on the substrate 300 h.

The wiring layer, the feed line, the feed via, the antenna member, the ground member, the second to fifth ground members, the impedance conversion line, the ground layer, the shielding via, the pole via, the ground via, the director member, the antenna member, the feed via, the electrical connection structure, and the plating member disclosed herein may include a metal material (e.g., a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy of any two or more thereof), and may be made by a plating method such as chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, a subtractive process, an additive process, a semi-additive process (SAP), or a modified semi-additive process (MSAP), but is not limited thereto.

The RF signal disclosed herein may have a format according to Wi-Fi (Institute of Electrical and Electronics Engineers (IEEE) 802.11 family) Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 Mobile Broadband Wireless Access (MBWA) (family), IEEE 802.20), Long-Term Evolution (LTE), Evolution-Data Optimized (EV-DO), Evolved High Speed Packet Access (HSPA+), High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), Enhanced Data Rates for GSM Evolution (EDGE), Global System for Mobile Communications (GSM), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code-Division Multiple Access (CDMA), Time-Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, 3G, 4G, and 5G protocols, and any other wireless and wired protocols, but is not limited thereto.

In the examples described above, the antenna module omnidirectionally expands the transmission and reception direction of the RF signal by forming radiation patterns for transmission and reception of the RF signal in first and second directions that are different from each other, and improves the antenna performance (e.g., the transmission and reception rate, the gain, the bandwidth, and the directivity) in the second direction or enables dual-band transmission and reception in the second direction.

In addition, the antenna module is easily miniaturized while improving the transmission and reception performance of the RF signal in the first and second directions.

The dual-band antenna apparatus transmits and receives a dual-band RF signal while having a simplified structure.

While this disclosure includes specific examples, it will be apparent to after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure. 

What is claimed is:
 1. An antenna module, comprising: patch antennas; feed vias coupled to the patch antennas; an integrated circuit (IC) electrically connected to the feed vias; a connection member disposed between the IC and the patch antennas, comprising a ground layer, and wiring members electrically connected to the IC and surrounded by the ground layer; feed lines electrically connected to the wiring members; dipole antennas electrically connected to the feed lines, and disposed on a first level between the patch antennas and the IC; and first arm members disposed on a second level between the dipole antennas and the IC, and separated from the dipole antennas and the ground layer, wherein at least portions of the first arm members overlap with the dipole antennas in a vertical direction.
 2. The antenna module of claim 1, wherein sizes of the first arm members are larger than sizes of the dipole antennas.
 3. The antenna module of claim 1, further comprising second arm members disposed on a third level between the dipole antennas and the patch antennas and overlapping with at least portions of the dipole antennas in the vertical direction.
 4. The antenna module of claim 1, wherein widths of the feed lines are wider than widths of the wiring members.
 5. The antenna module of claim 1, wherein the connection member further comprises shielding vias electrically connected to the ground layer and arranged to surround each of the wiring members.
 6. The antenna module of claim 1, wherein the connection member further comprises shielding vias electrically connected to the ground layer and arranged according to a boundary of the ground layer.
 7. The antenna module of claim 1, wherein distances between the first arm members and the dipole antennas are shorter than distances between the patch antennas and the ground layer.
 8. The antenna module of claim 1, further comprising director members separated from the patch antennas and overlapping with at least portions of the patch antennas in the vertical direction.
 9. An antenna module, comprising: patch antennas; feed vias coupled to the patch antennas; an integrated circuit (IC) electrically connected to the feed vias; a connection member disposed between the IC and the patch antennas, comprising a ground layer, and wiring members electrically connected to the IC and surrounded by the ground layer; feed lines electrically connected to the wiring members; dipole antennas electrically connected to the feed lines, and disposed on a first level between the patch antennas and the IC; and wherein the connection member further comprises shielding vias electrically connected to the ground layer and arranged according to a boundary of the ground layer.
 10. The antenna module of claim 9, wherein the shielding vias are arranged to surround each of the wiring members, and wherein widths of the feed lines are wider than widths of the wiring members.
 11. An antenna module, comprising: a connection member comprising wiring members and a ground layer surrounding the wiring members; a patch antenna disposed on a first surface of the connection member coupled to the wiring members by a feed via; a wiring via connected to the wiring members and configured to be connected to an integrated circuit (IC) disposed on a second surface of the connection member opposing the first surface in a vertical direction; a dipole antenna disposed between a level of the patch antenna and a level of the second surface, and connected to the wiring members by a feed line; and one or more arm members separated from the dipole antenna and the ground layer, and disposed to overlap with the dipole antenna in a vertical direction, above, below, or both above and below the dipole antenna between the level of the patch antenna and the level of the second surface.
 12. The antenna module of claim 11, wherein an area of the one or more arm members is greater than an area of the dipole antenna.
 13. The antenna module of claim 11, wherein a width of the feed line is greater than a width of the wiring members.
 14. The antenna module of claim 11, further comprising shielding vias disposed on the ground layer to surround the wiring members.
 15. The antenna module of claim 11, further comprising a plating member surrounding the feed via.
 16. An electronic device comprising: a case; and an antenna module according to claim 11 disposed in the case so that the dipole antenna is disposed toward a side surface of the case, and the patch antenna is disposed facing a front main surface or a back main surface of the case, wherein the IC is configured to receive a baseband signal and generate a radio frequency (RF) signal from the baseband signal, wherein the patch antenna is coupled to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in a first direction, and wherein the dipole antenna is connected to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in a second direction.
 17. An antenna module, comprising: a connection member comprising wiring members and a ground layer surrounding the wiring members; a patch antenna disposed on a first surface of the connection member coupled to the wiring members by a feed via; a wiring via connected to the wiring members and configured to be connected to an integrated circuit (IC) disposed on a second surface of the connection member opposing the first surface in a vertical direction; a dipole antenna disposed between a level of the patch antenna and a level of the second surface, and connected to the wiring members by a feed line; and shielding vias electrically connected to the ground layer and disposed along a boundary of the ground layer.
 18. The antenna module of claim 17, wherein the shielding vias are disposed to face the wiring members, and wherein the width of the feed line is greater than widths of the wiring members.
 19. The antenna module of claim 17, further comprising one or more arm members separated from the dipole antenna and the ground layer, and disposed to overlap with the dipole antenna in a vertical direction, above, below, or both above and below the dipole antenna between the level of the patch antenna and the level of the second surface.
 20. An electronic device comprising: a case; and an antenna module according to claim 17 disposed in the case so that the dipole antenna is disposed toward a side surface of the case, and the patch antenna is disposed facing a front main surface or a back main surface of the case, wherein the IC is configured to receive a baseband signal and generate a radio frequency (RF) signal from the baseband signal, wherein the patch antenna is coupled to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in a first direction, and wherein the dipole antenna is connected to the IC to receive the RF signal from the IC, and is configured to transmit the RF signal in a second direction. 